We studied the adhesion process of the soft rubber particle on a solid substrate using coarse-grained molecular dynamics simulation. The rubber particle, which was constituted by the bead spring chain with cross linker, was loaded to the solid substrate and the contact dynamics was simulated. From our simulation, the adhesion process can be analyzed using the rheological properties with changing the interaction between the polymer and substrate beads. These results indicate that the interaction from the substrate is much affected to the rheological properties of soft sphere attached with substrate.
21.Juni 2012 -